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AS1113
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
Characteristics on page 5 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
V DD to GND
Input Voltage
Output Voltage
GND Pin Current
Thermal Resistance Θ JA
Ambient Temperature
Storage Temperature
Humidity
Min
0
-0.4
-0.4
-40
-55
5
Max
7
V DD
+0.4
15
1000
88
23
+85
150
86
Units
V
V
V
mA
oC/W
oC/W
oC
oC
%
Comments
on PCB, 24-pin SSOP package
on PCB, 28-pin QFN (5x5mm) package
Non-condensing
Electrostatic
Discharge
Digital Outputs
All Other Pins
2
2
kV
Norm: MIL 833 E method 3015
Latch-Up Immunity
-100 -
(I NOM x 0.5)
+100 +
I NOM
mA
EIA/JESD78
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020D “Moisture/Reflow
Package Body Temperature
+260
oC
Sensitivity Classification for Non-Hermetic Solid
State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
www.austriamicrosystems.com/LED-Driver-ICs/AS1113
Revision 1.04
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